Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7534732 | Semiconductor devices with copper interconnects and composite silicon nitride capping layers | Minh Van Ngo, Erik Wilson, Hieu Pham, Robert A. Huertas, Lu You +2 more | 2009-05-19 |
| 7307027 | Void free interlayer dielectric | Minh Van Ngo, Hieu Pham, Jean Y. Yang, Hirokazu Tokuno, Weidong Qian | 2007-12-11 |
| 7102156 | Memory elements using organic active layer | Richard Kingsborough, Igor Sokolik, David Gaun, Swaroop Kaza, Suzette K. Pangrle +1 more | 2006-09-05 |
| 6936925 | Semiconductor device having copper lines with reduced electromigration using an electroplated interim copper-zinc alloy film on a copper surface | Sergey Lopatin | 2005-08-30 |
| 6811671 | Method of controlling zinc-doping in a copper-zinc alloy thin film electroplated on a copper surface and a semiconductor device thereby formed | Sergey Lopatin, Joffre F. Bernard | 2004-11-02 |
| 6717236 | Method of reducing electromigration by forming an electroplated copper-zinc interconnect and a semiconductor device thereby formed | Sergey Lopatin, Paul L. King | 2004-04-06 |
| 6660633 | Method of reducing electromigration in a copper line by electroplating an interim copper-zinc alloy thin film on a copper surface and a semiconductor device thereby formed | Sergey Lopatin | 2003-12-09 |
| 6624075 | Method of reducing electromigration in a copper line by Zinc-Doping of a copper surface from an electroplated copper-zinc alloy thin film and a semiconductor device thereby formed | Sergey Lopatin | 2003-09-23 |
| 6528424 | Method of electroplating a copper-zinc alloy thin film on a copper surface using a chemical solution | Sergey Lopatin | 2003-03-04 |
| 6515368 | Semiconductor device with copper-filled via includes a copper-zinc/alloy film for reduced electromigration of copper | Sergey Lopatin | 2003-02-04 |
| 6479879 | Low defect organic BARC coating in a semiconductor structure | Christopher Lee Pike | 2002-11-12 |