LY

Lu You

AM AMD: 84 patents #44 of 9,279Top 1%
SL Spansion Llc.: 5 patents #175 of 769Top 25%
Globalfoundries: 1 patents #2,221 of 4,424Top 55%
RI Rensselaer Polytechnic Institute: 1 patents #306 of 819Top 40%
📍 Troy, NY: #3 of 610 inventorsTop 1%
🗺 New York: #709 of 115,490 inventorsTop 1%
Overall (All Time): #18,466 of 4,157,543Top 1%
89
Patents All Time

Issued Patents All Time

Showing 51–75 of 89 patents

Patent #TitleCo-InventorsDate
6566283 Silane treatment of low dielectric constant materials in semiconductor device manufacturing Suzette K. Pangrle, Minh Van Ngo, Dawn Hopper 2003-05-20
6530340 Apparatus for manufacturing planar spin-on films Dawn Hopper, Richard J. Huang 2003-03-11
6518646 Semiconductor device with variable composition low-k inter-layer dielectric and method of making Dawn Hopper, Suzette K. Pangrle, Calvin T. Gabriel, Richard J. Huang 2003-02-11
6518167 Method of forming a metal or metal nitride interface layer between silicon nitride and copper Matthew S. Buynoski, Paul R. Besser, Jeremias D. Romero, Pin-Chin Connie Wang, Minh Quoc Tran 2003-02-11
6492257 Water vapor plasma for effective low-k dielectric resist stripping Jeffrey A. Shields, Mohammad R. Rakhshandehroo 2002-12-10
6489253 Method of forming a void-free interlayer dielectric (ILD0) for 0.18-&mgr;m flash memory technology and semiconductor device thereby formed Minh Van Ngo, Robert A. Huertas, King Wai Kelwin Ko, Pei-Yuan Gao 2002-12-03
6465361 Method for preventing damage of low-k dielectrics during patterning Steve Avanzino, Fei Wang 2002-10-15
6448594 Method and system for processing a semiconductor device Maria C. Chan, Hao Fang, Mark S. Chang, King Wai Kelwin Ko 2002-09-10
6445051 Method and system for providing contacts with greater tolerance for misalignment in a flash memory Mark S. Chang, Hao Fang, King Wai Kelwin Ko, John Jianshi Wang, Michael K. Templeton +1 more 2002-09-03
6420278 Method for improving the dielectric constant of silicon-based semiconductor materials Dawn Hopper, Richard J. Huang 2002-07-16
6417090 Damascene arrangement for metal interconnection using low k dielectric constant materials for etch stop layer Fei Wang 2002-07-09
6410458 Method and system for eliminating voids in a semiconductor device Dawn Hopper, John Jianshi Wang 2002-06-25
6407009 Methods of manufacture of uniform spin-on films Dawn Hopper, Richard J. Huang 2002-06-18
6388309 Apparatus and method for manufacturing semiconductors using low dielectric constant materials Dawn Hopper, Richard J. Huang 2002-05-14
6387825 Solution flow-in for uniform deposition of spin-on films Dawn Hopper, Richard J. Huang 2002-05-14
6383925 Method of improving adhesion of capping layers to cooper interconnects Minh Van Ngo, Robert A. Huertas, Ercan Adem 2002-05-07
6376309 Method for reduced gate aspect ratio to improve gap-fill after spacer etch John Jianshi Wang, Kent Kuohua Chang, Hao Fang 2002-04-23
6335533 Electron microscopy sample having silicon nitride passivation layer Guarionex Morales, Dawn Hopper 2002-01-01
6317642 Apparatus and methods for uniform scan dispensing of spin-on materials Dawn Hopper, Christof Streck, John G. Pellerin, Richard J. Huang 2001-11-13
6309959 Formation of self-aligned passivation for interconnect to minimize electromigration Pin-Chin Connie Wang, Joffre F. Bernard, Amit P. Marathe 2001-10-30
6300658 Method for reduced gate aspect ration to improve gap-fill after spacer etch John Jianshi Wang, Kent Kuohua Chang, Hao Fang 2001-10-09
6259115 Dummy patterning for semiconductor manufacturing processes Simon S. Chan, Kai Yang 2001-07-10
6235453 Low-k photoresist removal process Steven C. Avanzino, Jacques Bertrand, Richard J. Huang 2001-05-22
6225240 Rapid acceleration methods for global planarization of spin-on films Dawn Hopper, Richard J. Huang 2001-05-01
6207552 Forming and filling a recess in interconnect for encapsulation to minimize electromigration Pin-Chin Connie Wang 2001-03-27