Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6818557 | Method of forming SiC capped copper interconnects with reduced hillock formation and improved electromigration resistance | Minh Van Ngo, Christine Hau-Riege, Robert A. Huertas | 2004-11-16 |
| 6506668 | Utilization of annealing enhanced or repaired seed layer to improve copper interconnect reliability | Christy Mei-Chu Woo, Connie P. Wang | 2003-01-14 |
| 6465361 | Method for preventing damage of low-k dielectrics during patterning | Lu You, Fei Wang | 2002-10-15 |