Issued Patents All Time
Showing 76–89 of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6200913 | Cure process for manufacture of low dielectric constant interlevel dielectric layers | Simon S. Chan, John A. Iacoponi, Richard J. Huang, Robin Cheung | 2001-03-13 |
| 6197703 | Apparatus and method for manufacturing semiconductors using low dielectric constant materials | Dawn Hopper, Richard J. Huang | 2001-03-06 |
| 6171949 | Low energy passivation of conductive material in damascene process for semiconductors | Shekhar Pramanick | 2001-01-09 |
| 6147000 | Method for forming low dielectric passivation of copper interconnects | Shekhar Pramanick, Takeshi Nogami | 2000-11-14 |
| 6136729 | Method for improving semiconductor dielectrics | Dawn Hopper, Richard J. Huang | 2000-10-24 |
| 6100181 | Low dielectric constant coating of conductive material in a damascene process for semiconductors | John A. Iacoponi | 2000-08-08 |
| 6093635 | High integrity borderless vias with HSQ gap filled patterned conductive layers | Khanh Tran, Richard J. Huang, Simon S. Chan | 2000-07-25 |
| 6066574 | Hot plate cure process for BCB low k interlevel dielectric | Dawn Hopper, Christof Streck | 2000-05-23 |
| 6030901 | Photoresist stripping without degrading low dielectric constant materials | Dawn Hopper, Richard J. Huang, Jacques Bertrand | 2000-02-29 |
| 5888898 | HSQ baking for reduced dielectric constant | Minh Van Ngo, Khanh Tran, Terri Jo Kitson, Simon S. Chan, Jean Y. Yang | 1999-03-30 |
| 5888911 | HSQ processing for reduced dielectric constant | Minh Van Ngo, Khanh Tran, Jean Y. Yang, Richard J. Huang | 1999-03-30 |
| 5861677 | Low RC interconnection | Robin Cheung, Simon S. Chan, Richard J. Huang | 1999-01-19 |
| 5760480 | Low RC interconnection | Robin Cheung, Simon S. Chan, Richard J. Huang | 1998-06-02 |
| 5268202 | Vapor deposition of parylene-F using 1,4-bis (trifluoromethyl) benzene | Guang Yang, Toh-Ming Lu, James A. Moore, John McDonald | 1993-12-07 |