Issued Patents All Time
Showing 25 most recent of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6734559 | Self-aligned semiconductor interconnect barrier and manufacturing method therefor | Kai Yang, Takeshi Nogami, Dirk Brown | 2004-05-11 |
| 6670260 | Transistor with local insulator structure | Bin Yu, Ming-Ren Lin | 2003-12-30 |
| 6660634 | Method of forming reliable capped copper interconnects | Minh Van Ngo, Takeshi Nogami | 2003-12-09 |
| 6596598 | T-shaped gate device and method for making | Zoran Krivokapic, Sunny Cherian | 2003-07-22 |
| 6492266 | Method of forming reliable capped copper interconnects | Minh Van Ngo, Takeshi Nogami | 2002-12-10 |
| 6465341 | Manufacturing method for semiconductor interconnect barrier of boron silicon nitride | — | 2002-10-15 |
| 6465345 | Prevention of inter-channel current leakage in semiconductors | Takeshi Nogami | 2002-10-15 |
| 6380556 | Test structure used to measure metal bottom coverage in trenches and vias/contacts and method for creating the test structure | David Bang, Takeshi Nogami, Guarionex Morales | 2002-04-30 |
| 6380019 | Method of manufacturing a transistor with local insulator structure | Bin Yu, Ming-Ren Lin | 2002-04-30 |
| 6380625 | Semiconductor interconnect barrier and manufacturing method thereof | Takeshi Nogami | 2002-04-30 |
| 6372563 | Self-aligned SOI device with body contact and NiSi2 gate | Zoran Krivokapic | 2002-04-16 |
| 6369429 | Low resistance composite contact structure utilizing a reaction barrier layer under a metal layer | Ming-Ren Lin, Qi Xiang | 2002-04-09 |
| 6362526 | Alloy barrier layers for semiconductors | John A. Iacoponi | 2002-03-26 |
| 6362063 | Formation of low thermal budget shallow abrupt junctions for semiconductor devices | Witold P. Maszara, Srinath Krishnan | 2002-03-26 |
| 6361837 | Method and system for modifying and densifying a porous film | Suzette K. Pangrle, Richard J. Huang | 2002-03-26 |
| 6350678 | Chemical-mechanical polishing of semiconductors | Kai Yang | 2002-02-26 |
| 6344691 | Barrier materials for metal interconnect in a semiconductor device | John A. Iacoponi | 2002-02-05 |
| 6344410 | Manufacturing method for semiconductor metalization barrier | Sergey Lopatin, Dirk Brown | 2002-02-05 |
| 6303505 | Copper interconnect with improved electromigration resistance | Minh Van Ngo, Takeshi Nogami | 2001-10-16 |
| 6288448 | Semiconductor interconnect barrier of boron silicon nitride and manufacturing method therefor | — | 2001-09-11 |
| 6281587 | Multi-layered coaxial interconnect structure | Takeshi Nogami, Sergey Lopatin | 2001-08-28 |
| 6239452 | Self-aligned silicide gate technology for advanced deep submicron MOS device | Qi Xiang, Ming-Ren Lin | 2001-05-29 |
| 6239021 | Dual barrier and conductor deposition in a dual damascene process for semiconductors | Dirk Brown, John A. Iacoponi | 2001-05-29 |
| 6221724 | Method of fabricating an integrated circuit having punch-through suppression | Bin Yu | 2001-04-24 |
| 6214731 | Copper metalization with improved electromigration resistance | Takeshi Nogami, Minh Van Ngo | 2001-04-10 |