Issued Patents All Time
Showing 25 most recent of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11853357 | Method and system for dynamically analyzing, modifying, and distributing digital images and video | David M. Ludwigsen, Mark Bradshaw | 2023-12-26 |
| 11605227 | Method and system for dynamically analyzing, modifying, and distributing digital images and video | David M. Ludwigsen, Mark Bradshaw | 2023-03-14 |
| 11182618 | Method and system for dynamically analyzing, modifying, and distributing digital images and video | David M. Ludwigsen, Mark Bradshaw | 2021-11-23 |
| 9754166 | Method of identifying and replacing an object or area in a digital image with another object or area | David M. Ludwigsen, Robert John Glassett, Jason Griffith, Mark Bradshaw | 2017-09-05 |
| 9514381 | Method of identifying and replacing an object or area in a digital image with another object or area | David M. Ludwigsen, Robert John Glassett, Jason Griffith, Mark Bradshaw | 2016-12-06 |
| 8963926 | User customized animated video and method for making the same | David M. Ludwigsen, Loch T. Brown, Christopher James MacDonald, Harrison Rose, Jeffrey Alan Amdur +1 more | 2015-02-24 |
| 7758351 | Method and system for batch manufacturing of spring elements | John Williams, William B. Long, Tingbao Chen | 2010-07-20 |
| 7628617 | Structure and process for a contact grid array formed in a circuitized substrate | John Williams, William B. Long | 2009-12-08 |
| 7244125 | Connector for making electrical contact at semiconductor scales | John Williams, Eric Radza | 2007-07-17 |
| 7113408 | Contact grid array formed on a printed circuit board | John Williams | 2006-09-26 |
| 7070419 | Land grid array connector including heterogeneous contact elements | John Williams, Hongjun Yao | 2006-07-04 |
| 6916181 | Remountable connector for land grid array packages | John Williams, Hongjun Yao, Hassan Ali | 2005-07-12 |
| 6869290 | Circuitized connector for land grid array | John Williams, Hongjun Yao, Hassan Ali | 2005-03-22 |
| 6734559 | Self-aligned semiconductor interconnect barrier and manufacturing method therefor | Kai Yang, Takeshi Nogami, Shekhar Pramanick | 2004-05-11 |
| 6712621 | Thermally enhanced interposer and method | Che-Yu Li, Zhineng Fan | 2004-03-30 |
| 6712620 | Coaxial elastomeric connector system | Che-Yu Li, Zhineng Fan | 2004-03-30 |
| 6661690 | High capacity memory module with built-in performance enhancing features | Sharon L. Moriarty, Zineng Fan, Che-Yu Li | 2003-12-09 |
| 6344410 | Manufacturing method for semiconductor metalization barrier | Sergey Lopatin, Shekhar Pramanick | 2002-02-05 |
| 6306732 | Method and apparatus for simultaneously improving the electromigration reliability and resistance of damascene vias using a controlled diffusivity barrier | — | 2001-10-23 |
| 6281121 | Damascene metal interconnects using highly directional deposition of barrier and/or seed layers including (III) filling metal | Takeshi Nogami, Guarionex Morales | 2001-08-28 |
| 6261946 | Method for forming semiconductor seed layers by high bias deposition | John A. Iacoponi, Takeshi Nogami | 2001-07-17 |
| 6251772 | Dielectric adhesion enhancement in damascene process for semiconductors | — | 2001-06-26 |
| 6239021 | Dual barrier and conductor deposition in a dual damascene process for semiconductors | Shekhar Pramanick, John A. Iacoponi | 2001-05-29 |
| 6228754 | Method for forming semiconductor seed layers by inert gas sputter etching | John A. Iacoponi, Takeshi Nogami | 2001-05-08 |
| 6187670 | Multi-stage method for forming optimized semiconductor seed layers | John A. Iacoponi | 2001-02-13 |