DB

David Bang

AM AMD: 11 patents #1,098 of 9,279Top 15%
QU Qualcomm: 6 patents #2,896 of 12,104Top 25%
Overall (All Time): #276,727 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9159910 One-mask MTJ integration for STT MRAM Seung H. Kang, Kangho Lee 2015-10-13
8933567 Electrically broken, but mechanically continuous die seal for integrated circuits Thomas Andrew Myers 2015-01-13
8483997 Predictive modeling of contact and via modules for advanced on-chip interconnect technology Xia Li, Wei Zhao, Yu Cao, Seung H. Kang, Matthew Michael Nowak 2013-07-09
8207569 Intertwined finger capacitors 2012-06-26
7973541 Method and apparatus for estimating resistance and capacitance of metal interconnects Jayakannan Jayapalan, Yang Du 2011-07-05
7675372 Circuit simulator parameter extraction using a configurable ring oscillator Jayakannan Jayapalan 2010-03-09
6380556 Test structure used to measure metal bottom coverage in trenches and vias/contacts and method for creating the test structure Takeshi Nogami, Guarionex Morales, Shekhar Pramanick 2002-04-30
6274915 Method of improving MOS device performance by controlling degree of depletion in the gate electrode Srinath Krishnan, Ming-Yin Hao, Witold P. Maszara 2001-08-14
6268277 Method of producing air gap for reducing intralayer capacitance in metal layers in damascene metalization process and product resulting therefrom 2001-07-31
6169039 Electron bean curing of low-k dielectrics in integrated circuits Ming-Ren Lin, Shekhar Pramanick 2001-01-02
6127193 Test structure used to measure metal bottom coverage in trenches and vias/contacts and method for creating the test structure Takeshi Nogami, Guarionex Morales, Shekhar Pramanick 2000-10-03
6047243 Method for quantifying ultra-thin dielectric reliability: time dependent dielectric wear-out Qi Xiang 2000-04-04
5953625 Air voids underneath metal lines to reduce parasitic capacitance 1999-09-14
5949143 Semiconductor interconnect structure with air gap for reducing intralayer capacitance in metal layers in damascene metalization process 1999-09-07
5643428 Multiple tier collimator system for enhanced step coverage and uniformity Zoran Krivokapic 1997-07-01
5580428 PVD sputter system having nonplanar target configuration and methods for constructing same Zoran Krivokapic 1996-12-03
5556525 PVD sputter system having nonplanar target configuration and methods for operating same Zoran Krivokapic 1996-09-17