Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9159910 | One-mask MTJ integration for STT MRAM | Seung H. Kang, Kangho Lee | 2015-10-13 |
| 8933567 | Electrically broken, but mechanically continuous die seal for integrated circuits | Thomas Andrew Myers | 2015-01-13 |
| 8483997 | Predictive modeling of contact and via modules for advanced on-chip interconnect technology | Xia Li, Wei Zhao, Yu Cao, Seung H. Kang, Matthew Michael Nowak | 2013-07-09 |
| 8207569 | Intertwined finger capacitors | — | 2012-06-26 |
| 7973541 | Method and apparatus for estimating resistance and capacitance of metal interconnects | Jayakannan Jayapalan, Yang Du | 2011-07-05 |
| 7675372 | Circuit simulator parameter extraction using a configurable ring oscillator | Jayakannan Jayapalan | 2010-03-09 |
| 6380556 | Test structure used to measure metal bottom coverage in trenches and vias/contacts and method for creating the test structure | Takeshi Nogami, Guarionex Morales, Shekhar Pramanick | 2002-04-30 |
| 6274915 | Method of improving MOS device performance by controlling degree of depletion in the gate electrode | Srinath Krishnan, Ming-Yin Hao, Witold P. Maszara | 2001-08-14 |
| 6268277 | Method of producing air gap for reducing intralayer capacitance in metal layers in damascene metalization process and product resulting therefrom | — | 2001-07-31 |
| 6169039 | Electron bean curing of low-k dielectrics in integrated circuits | Ming-Ren Lin, Shekhar Pramanick | 2001-01-02 |
| 6127193 | Test structure used to measure metal bottom coverage in trenches and vias/contacts and method for creating the test structure | Takeshi Nogami, Guarionex Morales, Shekhar Pramanick | 2000-10-03 |
| 6047243 | Method for quantifying ultra-thin dielectric reliability: time dependent dielectric wear-out | Qi Xiang | 2000-04-04 |
| 5953625 | Air voids underneath metal lines to reduce parasitic capacitance | — | 1999-09-14 |
| 5949143 | Semiconductor interconnect structure with air gap for reducing intralayer capacitance in metal layers in damascene metalization process | — | 1999-09-07 |
| 5643428 | Multiple tier collimator system for enhanced step coverage and uniformity | Zoran Krivokapic | 1997-07-01 |
| 5580428 | PVD sputter system having nonplanar target configuration and methods for constructing same | Zoran Krivokapic | 1996-12-03 |
| 5556525 | PVD sputter system having nonplanar target configuration and methods for operating same | Zoran Krivokapic | 1996-09-17 |