Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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David Bang — 17 Patents

AMD: 11 patents #1,212 of 9,280Top 15%
Qualcomm: 6 patents #2,934 of 12,104Top 25%
Palo Alto, CA: #1,439 of 9,675 inventorsTop 15%
California: #35,467 of 386,348 inventorsTop 10%
Overall (All Time): #263,971 of 4,157,543Top 7%
17 Patents All Time
David Bang has been granted 17 US patents while listed as an inventor at AMD. The first was granted in 1996 and the most recent in October 2015. David Bang ranks #263,971 of 4,157,543 US inventors in our database (top 6.3%). Patent records list David Bang in Palo Alto, CA, US.

Issued Patents All Time

Showing 1–17 of 17 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
9159910 One-mask MTJ integration for STT MRAM Seung H. Kang, Kangho Lee 2015-10-13 $6,383,000
8933567 Electrically broken, but mechanically continuous die seal for integrated circuits Thomas Andrew Myers 2015-01-13 $10,324,000
8483997 Predictive modeling of contact and via modules for advanced on-chip interconnect technology Xia Li, Wei Zhao, Yu Cao, Seung H. Kang, Matthew Michael Nowak 2013-07-09 $8,275,000
8207569 Intertwined finger capacitors 2012-06-26 $12,388,000
7973541 Method and apparatus for estimating resistance and capacitance of metal interconnects Jayakannan Jayapalan, Yang Du 2011-07-05 $24,573,000
7675372 Circuit simulator parameter extraction using a configurable ring oscillator Jayakannan Jayapalan 2010-03-09 $21,716,000
6380556 Test structure used to measure metal bottom coverage in trenches and vias/contacts and method for creating the test structure Takeshi Nogami, Guarionex Morales, Shekhar Pramanick 2002-04-30 $1,930,000
6274915 Method of improving MOS device performance by controlling degree of depletion in the gate electrode Srinath Krishnan, Ming-Yin Hao, Witold P. Maszara 2001-08-14 $3,163,000
6268277 Method of producing air gap for reducing intralayer capacitance in metal layers in damascene metalization process and product resulting therefrom 2001-07-31 $5,560,000
6169039 Electron bean curing of low-k dielectrics in integrated circuits Ming-Ren Lin, Shekhar Pramanick 2001-01-02 $6,157,000
6127193 Test structure used to measure metal bottom coverage in trenches and vias/contacts and method for creating the test structure Takeshi Nogami, Guarionex Morales, Shekhar Pramanick 2000-10-03 $5,403,000
6047243 Method for quantifying ultra-thin dielectric reliability: time dependent dielectric wear-out Qi Xiang 2000-04-04 $6,962,000
5953625 Air voids underneath metal lines to reduce parasitic capacitance 1999-09-14 $3,488,000
5949143 Semiconductor interconnect structure with air gap for reducing intralayer capacitance in metal layers in damascene metalization process 1999-09-07 $3,060,000
5643428 Multiple tier collimator system for enhanced step coverage and uniformity Zoran Krivokapic 1997-07-01 $9,468,000
5580428 PVD sputter system having nonplanar target configuration and methods for constructing same Zoran Krivokapic 1996-12-03 $4,546,000
5556525 PVD sputter system having nonplanar target configuration and methods for operating same Zoran Krivokapic 1996-09-17 $3,034,000