Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Test structure used to measure metal bottom coverage in trenches and vias/contacts and method for creating the test structure

Test structure used to measure metal bottom coverage in trenches and vias/contacts and method for creating the test structure

US Patent 6127193 · Granted Oct 3, 2000

Estimated economic value: $5,403,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Self-forming embedded diffusion barriers2025
Backside electrical contacts to buried power rails2024
Substrate thinning for a backside power distribution network2024
Semiconductor interconnect structure with double conductors2024
Backside metal-insulator-metal (MIM) capacitors extending through backside inter2024
Semiconductor structure having alternating selective metal and dielectric layers2024
Backside power rail integration2024
Composite interconnect formation using graphene2024
Method of forming copper interconnect structure with manganese barrier layer2023
Topological semi-metal interconnects2023
Self-forming barrier for use in air gap formation2023
Laser machine2022