| 6388330 |
Low dielectric constant etch stop layers in integrated circuit interconnects |
Minh Van Ngo, Dawn Hopper, Robert A. Huertas |
2002-05-14 |
| 6140255 |
Method for depositing silicon nitride using low temperatures |
Minh Van Ngo, Khanh B. Nguyen |
2000-10-31 |
| 6114224 |
System and method for using N.sub.2 O plasma treatment to eliminate defects at an interface between a stop layer and an integral layered dielectric |
Minh Van Ngo |
2000-09-05 |
| 6096661 |
Method for depositing silicon dioxide using low temperatures |
Minh Van Ngo, Khanh B. Nguyen |
2000-08-01 |
| 6060404 |
In-situ deposition of stop layer and dielectric layer during formation of local interconnects |
Minh Van Ngo, Darin A. Chan, Sey-Ping Sun, John Caffall |
2000-05-09 |
| 5888898 |
HSQ baking for reduced dielectric constant |
Minh Van Ngo, Khanh Tran, Lu You, Simon S. Chan, Jean Y. Yang |
1999-03-30 |