Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6875668 | Notched gate structure fabrication | Scott A. Bell | 2005-04-05 |
| 6740566 | Ultra-thin resist shallow trench process using high selectivity nitride etch | Christopher F. Lyons, Scott A. Bell, Harry J. Levinson, Fei Wang, Chih-Yuh Yang | 2004-05-25 |
| 6544885 | Polished hard mask process for conductor layer patterning | Harry J. Levinson, Christopher F. Lyons, Scott A. Bell, Fei Wang, Chih-Yuh Yang | 2003-04-08 |
| 6492067 | Removable pellicle for lithographic mask protection and handling | Leonard E. Klebanoff, Daniel J. Rader, Scott D. Hector, Richard H. Stulen | 2002-12-10 |
| 6440640 | Thin resist with transition metal hard mask for via etch application | Chih-Yuh Yang, Christopher F. Lyons, Harry J. Levinson, Fei Wang, Scott A. Bell | 2002-08-27 |
| 6414326 | Technique to separate dose-induced vs. focus-induced CD or linewidth variation | — | 2002-07-02 |
| 6370680 | Device to determine line edge roughness effect on device performance | — | 2002-04-09 |
| 6326319 | Method for coating ultra-thin resist films | Christopher Lee Pike, Christopher F. Lyons | 2001-12-04 |
| 6316277 | Tuning substrate/resist contrast to maximize defect inspection sensitivity for ultra-thin resist in DUV lithography | Khoi A. Phan, Christopher F. Lyons, Jeff Schefske | 2001-11-13 |
| 6309926 | Thin resist with nitride hard mask for gate etch application | Scott A. Bell, Christopher F. Lyons, Harry J. Levinson, Fei Wang, Chih-Yuh Yang | 2001-10-30 |
| 6306560 | Ultra-thin resist and SiON/oxide hard mask for metal etch | Fei Wang, Christopher F. Lyons, Scott A. Bell, Harry J. Levinson, Chih-Yuh Yang | 2001-10-23 |
| 6271602 | Method for reducing the susceptibility to chemical-mechanical polishing damage of an alignment mark formed in a semiconductor substrate | Paul Ackmann, Richard D. Edwards, Stuart E. Brown | 2001-08-07 |
| 6255125 | Method and apparatus for compensating for critical dimension variations in the production of a semiconductor wafer | Regina Tien Schmidt, Christopher A. Spence, Anna M. Minvielle, Marina V. Plat | 2001-07-03 |
| 6208747 | Determination of scanning error in scanner by reticle rotation | Harry J. Levinson | 2001-03-27 |
| 6207966 | Mark protection with transparent film | Harry J. Levinson, Richard D. Edwards, Stuart E. Brown, Paul Ackmann | 2001-03-27 |
| 6200907 | Ultra-thin resist and barrier metal/oxide hard mask for metal etch | Fei Wang, Christopher F. Lyons, Scott A. Bell, Harry J. Levinson, Chih-Yuh Yang | 2001-03-13 |
| 6184128 | Method using a thin resist mask for dual damascene stop layer etch | Fei Wang, Christopher F. Lyons, Scott A. Bell, Harry J. Levinson, Chih-Yuh Yang | 2001-02-06 |
| 6178256 | Removal of reticle effect on critical dimension by reticle rotation | Paul Ackmann, Stuart E. Brown | 2001-01-23 |
| 6178221 | Lithography reflective mask | Harry J. Levinson | 2001-01-23 |
| 6171763 | Ultra-thin resist and oxide/nitride hard mask for metal etch | Fei Wang, Christopher F. Lyons, Scott A. Bell, Harry J. Levinson, Chih-Yuh Yang | 2001-01-09 |
| 6165695 | Thin resist with amorphous silicon hard mask for via etch application | Chih-Yuh Yang, Christopher F. Lyons, Harry J. Levinson, Fei Wang, Scott A. Bell | 2000-12-26 |
| 6162587 | Thin resist with transition metal hard mask for via etch application | Chih-Yuh Yang, Christopher F. Lyons, Harry J. Levinson, Fei Wang, Scott A. Bell | 2000-12-19 |
| 6159643 | Extreme ultraviolet lithography reflective mask | Harry J. Levinson | 2000-12-12 |
| 6156658 | Ultra-thin resist and silicon/oxide hard mask for metal etch | Fei Wang, Christopher F. Lyons, Scott A. Bell, Harry J. Levinson, Chih-Yuh Yang | 2000-12-05 |
| 6140023 | Method for transferring patterns created by lithography | Harry J. Levinson, Scott A. Bell, Christopher F. Lyons, Fei Wang, Chih-Yuh Yang | 2000-10-31 |