Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8698312 | Semiconductor device including a hybrid metallization layer stack for enhanced mechanical strength during and after packaging | James Werking, Frank Feustel, Christian Zistl | 2014-04-15 |
| 8097542 | Etch stop layer of reduced thickness for patterning a dielectric material in a contact level of closely spaced transistors | Karsten Wieczorek, Manfred Horstmann, Kerstin Ruttloff | 2012-01-17 |
| 8039395 | Technique for forming embedded metal lines having increased resistance against stress-induced material transport | Moritz Andreas Meyer, Hans-Juergen Engelmann, Ehrenfried Zschech | 2011-10-18 |
| 7416992 | Method of patterning a low-k dielectric using a hard mask | Matthias Lehr, Christian Zistl | 2008-08-26 |
| 7183629 | Metal line having an increased resistance to electromigration along an interface of a dielectric barrier layer by implanting material into the metal line | Hans-Juergen Engelmann, Ehrenfried Zschech | 2007-02-27 |
| 7063091 | Method for cleaning the surface of a substrate | Frank Koschinsky, Volker Kahlert | 2006-06-20 |