HE

Hans-Juergen Engelmann

AM AMD: 2 patents #3,994 of 9,279Top 45%
Globalfoundries: 1 patents #2,221 of 4,424Top 55%
Overall (All Time): #1,564,386 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8039395 Technique for forming embedded metal lines having increased resistance against stress-induced material transport Moritz Andreas Meyer, Ehrenfried Zschech, Peter Huebler 2011-10-18
7183629 Metal line having an increased resistance to electromigration along an interface of a dielectric barrier layer by implanting material into the metal line Ehrenfried Zschech, Peter Huebler 2007-02-27
6303399 Method of sample preparation for electron microscopy Beate Volkmann, Ehrenfried Zschech 2001-10-16