Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7375032 | Semiconductor substrate thinning method for manufacturing thinned die | Frank Seliger, Matthias Lehr, Marcel Wieland, Frank Kuechenmeister | 2008-05-20 |
| 6596631 | Method of forming copper interconnect capping layers with improved interface and adhesion | Minh Van Ngo, Hartmut Ruelke, Joerg Hohage, Lu You, Robert A. Huertas +1 more | 2003-07-22 |
| 6368948 | Method of forming capped copper interconnects with reduced hillocks | Minh Van Ngo, Hartmut Ruelke, Joerg Hohage | 2002-04-09 |