Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device with superior crack resistivity in the metallization system

Semiconductor device with superior crack resistivity in the metallization system

US Patent 10340229 · Granted Jul 2, 2019

Estimated economic value: $29,708,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Communication system for an aircraft2025
Crackstop structures2025
Crackstop structures2023
Back end of the line metal structure and method2021
Crack detecting and monitoring system for an integrated circuit2021
Semiconductor device comprising a die seal including long via lines2020
Semiconductor device comprising a die seal including long via lines2018
Vertical breakdown protection layer2016
Detecting anomalous weak BEOL sites in a metallization system2015
Pillar structure for use in packaging integrated circuit products and methods of2015
Detecting anomalous stiff pillar bumps formed above a metallization system2015
Repairing anomalous stiff pillar bumps2014