Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8925396 | Method and system for particles analysis in microstructure devices by isolating particles | Petra Hetzer, Dmytro Chumakov | 2015-01-06 |
| 8888947 | Method and system for advanced process control in an etch system by gas flow control on the basis of CD measurements | Uwe Schulze, Mathias Baranyai | 2014-11-18 |
| 8835245 | Semiconductor device comprising self-aligned contact elements | Peter Baars, Till Schloesser, Frank Jakubowski, Andy Wei, Richard J. Carter | 2014-09-16 |
| 8658494 | Dual contact metallization including electroless plating in a semiconductor device | Kai Frohberg, Juergen Boemmels, Sven Mueller | 2014-02-25 |
| 8575041 | Repair of damaged surface areas of sensitive low-K dielectrics of microstructure devices after plasma processing by in situ treatment | Daniel Fischer, Thomas Oszinda | 2013-11-05 |
| 8440579 | Re-establishing surface characteristics of sensitive low-k dielectrics in microstructure device by using an in situ surface modification | Daniel Fischer, Thomas Oszinda | 2013-05-14 |
| 8435885 | Method and system for extracting samples after patterning of microstructure devices | Dmytro Chumakov, Petra Hetzer | 2013-05-07 |
| 8423320 | Method and system for quantitative inline material characterization in semiconductor production processes based on structural measurements and related models | Thomas Oszinda, Christin Bartsch, Daniel Fischer | 2013-04-16 |
| 8399358 | Establishing a hydrophobic surface of sensitive low-k dielectrics of microstructure devices by in situ plasma treatment | Daniel Fischer | 2013-03-19 |
| 8338293 | Method of reducing erosion of a metal cap layer during via patterning in semiconductor devices | Christin Bartsch, Daniel Fischer | 2012-12-25 |
| 8110498 | Method for passivating exposed copper surfaces in a metallization layer of a semiconductor device | Daniel Fischer, Susanne Leppack | 2012-02-07 |
| 8101524 | Technique for enhancing the fill capabilities in an electrochemical deposition process by edge rounding of trenches | Kai Frohberg, Massud Aminpur | 2012-01-24 |
| 8062982 | High yield plasma etch process for interlayer dielectrics | Daniel Fischer, Matthias Lehr, Kornelia Dittmar | 2011-11-22 |
| 7986040 | Method of reducing erosion of a metal cap layer during via patterning in semiconductor devices | Christin Bartsch, Daniel Fischer | 2011-07-26 |
| 7883629 | Technique for patterning differently stressed layers formed above transistors by enhanced etch control strategies | Heike Salz, Ralf Richter, Sylvio Mattick | 2011-02-08 |
| 7763547 | Technique for enhancing process flexibility during the formation of vias and trenches in low-k interlayer dielectrics | Thomas Werner, Massud Aminpur | 2010-07-27 |
| 7763532 | Technique for forming a dielectric etch stop layer above a structure including closely spaced lines | Kai Frohberg, Roberto Klinger | 2010-07-27 |
| 7704889 | Method and system for advanced process control in an etch system by gas flow control on the basis of CD measurements | Uwe Schulze, Mathias Baranyai | 2010-04-27 |
| 7700377 | Method for reducing etch-induced process uniformities by omitting deposition of an endpoint detection layer during patterning of stressed overlayers in a semiconductor device | Ralf Richter, Heike Salz | 2010-04-20 |
| 7678690 | Semiconductor device comprising a contact structure with increased etch selectivity | Ralf Richter, Carsten Peters, Heike Salz | 2010-03-16 |
| 7611991 | Technique for increasing adhesion of metallization layers by providing dummy vias | Ralf Richter, Ellen Claus, Eckhard Langer | 2009-11-03 |
| 7608501 | Technique for creating different mechanical strain by forming a contact etch stop layer stack having differently modified intrinsic stress | Kai Frohberg, Carsten Peters, Heike Salz | 2009-10-27 |
| 7592258 | Metallization layer of a semiconductor device having differently thick metal lines and a method of forming the same | Matthias Lehr, Carsten Peters | 2009-09-22 |
| 7550396 | Method for reducing resist poisoning during patterning of silicon nitride layers in a semiconductor device | Kai Frohberg, Volker Grimm, Sven Mueller, Matthias Lehr, Ralf Richter +4 more | 2009-06-23 |
| 7517816 | Technique for creating different mechanical stress in different channel regions by forming an etch stop layer having differently modified intrinsic stress | Kai Frohberg, Massud Aminpur | 2009-04-14 |