Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7611991 | Technique for increasing adhesion of metallization layers by providing dummy vias | Ralf Richter, Matthias Schaller, Eckhard Langer | 2009-11-03 | $7,148,000 |