| 9006114 |
Method for selectively removing a spacer in a dual stress liner approach |
Kai Frohberg, Volker Grimm, Heike Berthold |
2015-04-14 |
| 8390127 |
Contact trenches for enhancing stress transfer in closely spaced transistors |
Andy Wei, Jan Hoentschel |
2013-03-05 |
| 8338314 |
Technique for reducing topography-related irregularities during the patterning of a dielectric material in a contact level of closely spaced transistors |
Ralf Richter, Robert Seidel |
2012-12-25 |
| 8034726 |
Interlayer dielectric material in a semiconductor device comprising a doublet structure of stressed materials |
Ralf Richter, Michael Finken, Joerg Hohage |
2011-10-11 |
| 7883629 |
Technique for patterning differently stressed layers formed above transistors by enhanced etch control strategies |
Matthias Schaller, Ralf Richter, Sylvio Mattick |
2011-02-08 |
| 7763507 |
Stressed interlayer dielectric with reduced probability for void generation in a semiconductor device by using an intermediate etch control layer of increased thickness |
Ralf Richter, Thorsten Kammler, Volker Grimm |
2010-07-27 |
| 7700377 |
Method for reducing etch-induced process uniformities by omitting deposition of an endpoint detection layer during patterning of stressed overlayers in a semiconductor device |
Ralf Richter, Matthias Schaller |
2010-04-20 |
| 7678690 |
Semiconductor device comprising a contact structure with increased etch selectivity |
Ralf Richter, Carsten Peters, Matthias Schaller |
2010-03-16 |
| 7608501 |
Technique for creating different mechanical strain by forming a contact etch stop layer stack having differently modified intrinsic stress |
Kai Frohberg, Carsten Peters, Matthias Schaller |
2009-10-27 |
| 7550396 |
Method for reducing resist poisoning during patterning of silicon nitride layers in a semiconductor device |
Kai Frohberg, Volker Grimm, Sven Mueller, Matthias Lehr, Ralf Richter +4 more |
2009-06-23 |
| 7482219 |
Technique for creating different mechanical strain by a contact etch stop layer stack with an intermediate etch stop layer |
Kai Frohberg, Carsten Peters, Matthias Schaller |
2009-01-27 |
| 7416973 |
Method of increasing the etch selectivity in a contact structure of semiconductor devices |
Carsten Peters, Ralf Richter, Matthias Schaller |
2008-08-26 |
