| 12479077 |
Portable power tool |
Klaus-Peter Bohn, Manfred Hartmann, Maria Zivcec, Donato Clausi |
2025-11-25 |
|
| 11850716 |
Drill for chiselling rock |
Klaus-Peter Bohn, Roland Foser, Markus Hartmann, Bastian Pluemacher |
2023-12-26 |
|
| 11577429 |
Manufacturing process, tool stand, and drill bit |
Guenter DOMANI, Florian SCHROEDER |
2023-02-14 |
|
| 11213939 |
Chisel |
Zsolt Kosa, Aviral Shrot, Attila Kenez |
2022-01-04 |
|
| 11123855 |
Control method and borehole flushing module |
Markus Hartmann, Klaus-Peter Bohn, Bastian Pluemacher, Michael Brunner, Helene Wesseler |
2021-09-21 |
|
| 11031406 |
Semiconductor devices having silicon/germanium active regions with different germanium concentrations |
Elliot John Smith, Gunter Grasshoff |
2021-06-08 |
|
| 10940527 |
Manufacturing process, tool stand, and drill bit |
Guenter DOMANI, Florian SCHROEDER |
2021-03-09 |
|
| 10906166 |
Control method and portable power tool |
Helene Wesseler, Markus Hartmann, Klaus-Peter Bohn, Thilo Hammers, Bastian Pluemacher |
2021-02-02 |
|
| 10522555 |
Semiconductor devices including Si/Ge active regions with different Ge concentrations |
Elliot John Smith, Gunter Grasshoff |
2019-12-31 |
$50,351,000 |
| 10483154 |
Front-end-of-line device structure and method of forming such a front-end-of-line device structure |
Elliot John Smith, Marcus Wolf, Markus Lenski, Loic Gaben |
2019-11-19 |
$41,143,000 |
| 10252321 |
Twist drill and production method |
Corinna Achleitner, Mark Winkler, Guenter DOMANI |
2019-04-09 |
|
| 10245657 |
Twist drill and production method |
Corinna Achleitner, Guenter DOMANI, Mark Winkler |
2019-04-02 |
|
| 10157774 |
Contact scheme for landing on different contact area levels |
Peter Baars |
2018-12-18 |
$19,355,000 |
| 9305878 |
Integrated circuits and methods for fabricating integrated circuits with capping layers between metal contacts and interconnects |
Torsten Huisinga, Andreas Ott, Axel Preusse |
2016-04-05 |
$1,295,000 |
| 9257329 |
Methods for fabricating integrated circuits including densifying interlevel dielectric layers |
Oliver Mieth, Torsten Huisinga |
2016-02-09 |
$571,000 |
| 8932911 |
Integrated circuits and methods for fabricating integrated circuits with capping layers between metal contacts and interconnects |
Torsten Huisinga, Andreas Ott, Axel Preusse |
2015-01-13 |
$1,493,000 |
| 8772154 |
Integrated circuits including barrier polish stop layers and methods for the manufacture thereof |
Egon Ronny Pfützner, Jens Heinrich |
2014-07-08 |
$2,496,000 |
| 8580684 |
Contact elements of semiconductor devices comprising a continuous transition to metal lines of a metallization layer |
Robert Seidel, Kai Frohberg |
2013-11-12 |
$1,972,000 |
| 8293641 |
Nano imprint technique with increased flexibility with respect to alignment and feature shaping |
Robert Seidel, Frank Feustel |
2012-10-23 |
$1,510,000 |
| 8173538 |
Method of selectively forming a conductive barrier layer by ALD |
Frank Feustel, Thomas Foltyn |
2012-05-08 |
$5,720,000 |
| 7998823 |
Method for reducing leakage currents caused by misalignment of a contact structure by increasing an error tolerance of the contact patterning process |
Kai Frohberg, Ralf Richter |
2011-08-16 |
$3,370,000 |
| 7928004 |
Nano imprint technique with increased flexibility with respect to alignment and feature shaping |
Robert Seidel, Frank Feustel |
2011-04-19 |
$7,054,000 |
| 7915170 |
Reducing contamination of semiconductor substrates during beol processing by providing a protection layer at the substrate edge |
Su Ruo Qing, Frank Feustel |
2011-03-29 |
$9,579,000 |
| 7910496 |
Technique for forming an interlayer dielectric material of increased reliability above a structure including closely spaced lines |
Frank Feustel, Kai Frohberg |
2011-03-22 |
$12,658,000 |
| 7906815 |
Increased reliability for a contact structure to connect an active region with a polysilicon line |
Ralf Richter, Kai Frohberg |
2011-03-15 |
$6,095,000 |
