Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682591 | Method for forming transistor structures | Boon Teik Chan, Basoene Briggs | 2023-06-20 |
| 11677401 | 3D integrated count | Francky Catthoor, Edouard Giacomin, Julien Ryckaert | 2023-06-13 |
| 11515399 | Self-aligned contacts for walled nanosheet and forksheet field effect transistor devices | Eugenio Dentoni Litta, Julien Ryckaert, Naoto Horiguchi, Pieter Weckx | 2022-11-29 |
| 11488826 | Self-aligned layer patterning | Boon Teik Chan, Yong Kong Siew | 2022-11-01 |
| 11462443 | Self-aligned contacts for nanosheet field effect transistor devices | Eugenio Dentoni Litta, Julien Ryckaert, Naoto Horiguchi, Pieter Weckx | 2022-10-04 |
| 11381242 | 3D integrated circuit | Francky Catthoor, Edouard Giacomin, Julien Ryckaert | 2022-07-05 |
| 11295977 | Standard cell device and method of forming an interconnect structure for a standard cell device | Julien Ryckaert | 2022-04-05 |
| 11257823 | Semiconductor device having vertical transistors and method of forming same | — | 2022-02-22 |
| 11244949 | Semiconductor device having stacked transistor pairs and method of forming same | Pieter Weckx, Julien Ryckaert | 2022-02-08 |
| 11127627 | Method for forming an interconnection structure | Frederic Lazzarino, Guillaume Bouche | 2021-09-21 |
| 10847415 | Self-aligned gate contact | Julien Ryckaert | 2020-11-24 |
| 10833161 | Semiconductor device and method | Syed Muhammad Yasser Sherazi, Julien Ryckaert, Guillaume Bouche | 2020-11-10 |
| 10763159 | Method for forming a multi-level interconnect structure | Basoene Briggs, Christopher Wilson | 2020-09-01 |
| 10748815 | Three-dimensional semiconductor device and method of manufacturing same | Julien Ryckaert | 2020-08-18 |
| 10566236 | Method of forming vertical channel devices | — | 2020-02-18 |
| 10546930 | Method of forming vertical channel devices | — | 2020-01-28 |
| 10395978 | Method of patterning target layer | Basoene Briggs, Farid Sebaai, Zsolt Tokei, Christopher Wilson, Katia Devriendt | 2019-08-27 |
| 10374084 | Vertical channel devices and method of fabricating same | — | 2019-08-06 |
| 10242907 | Method for interrupting a line in an interconnect | Julien Ryckaert, Christopher Wilson | 2019-03-26 |
| 9859161 | Self-aligned interconnects | Zsolt Tokei, Christopher Wilson | 2018-01-02 |
| 8741770 | Semiconductor device and method for patterning vertical contacts and metal lines in a common etch process | Ralf Richter, Robert Seidel, Thomas Foltyn | 2014-06-03 |
| 8658494 | Dual contact metallization including electroless plating in a semiconductor device | Kai Frohberg, Matthias Schaller, Sven Mueller | 2014-02-25 |
| 8404577 | Semiconductor device having a grain orientation layer | Matthias Lehr, Ralf Richter | 2013-03-26 |
| 8198190 | Semiconductor device and method for patterning vertical contacts and metal lines in a common etch process | Ralf Richter, Robert Seidel, Thomas Foltyn | 2012-06-12 |
| 8097536 | Reducing metal voids in a metallization layer stack of a semiconductor device by providing a dielectric barrier layer | Holger Schuehrer | 2012-01-17 |