Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and method for chemical mechanical polishing of a substrate

Apparatus and method for chemical mechanical polishing of a substrate

US Patent 6752697 · Granted Jun 22, 2004

Estimated economic value: $4,162,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Contact elements of a semiconductor device formed by electroless plating and exc2015
Method and system for controlling chemical mechanical polishing by controllably 2014
Contact elements of a semiconductor device formed by electroless plating and exc2013
Semiconductor device formed by a replacement gate approach based on an early wor2013
CMP system and method using individually controlled temperature zones2012
Reduced defectivity in contacts of a semiconductor device comprising replacement2012
System and method for optical endpoint detection during CMP by using an across-s2012
Superior fill conditions in a replacement gate approach by performing a polishin2012
Technique for electrochemically depositing an alloy having a chemical order2011
Method and system for controlling chemical mechanical polishing by controllably 2011
Polishing head using zone control2011
Method of reworking a semiconductor structure2009