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Contact elements of a semiconductor device formed by electroless plating and excess material removal with reduced sheer forces |
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Method and system for controlling chemical mechanical polishing by controllably moving a slurry outlet |
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2014-01-07 |
| 8450197 |
Contact elements of a semiconductor device formed by electroless plating and excess material removal with reduced sheer forces |
Axel Preusse, Norbert Schroeder |
2013-05-28 |
| 7980922 |
Method and system for controlling chemical mechanical polishing by controllably moving a slurry outlet |
Axel Kiesel, John Lampett, Heiko Wundram |
2011-07-19 |
| 7476552 |
Method of reworking a semiconductor structure |
Axel Preusse, Markus Nopper |
2009-01-13 |
| 7150675 |
Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner |
Jens Kramer, Jens Kunath |
2006-12-19 |
| 6752697 |
Apparatus and method for chemical mechanical polishing of a substrate |
Gerd Marxsen |
2004-06-22 |
| 6699107 |
Polishing head and apparatus with an improved pad conditioner for chemical mechanical polishing |
Gerd Marxsen |
2004-03-02 |
