Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and method for removing bubbles from a process liquid

Apparatus and method for removing bubbles from a process liquid

US Patent 7615103 · Granted Nov 10, 2009

Estimated economic value: $22,613,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor structure including a layer of a first metal between a diffusion b2017
Integrated circuits and methods for fabricating integrated circuits with capping2016
Contact elements of a semiconductor device formed by electroless plating and exc2015
Integrated circuits and methods for fabricating integrated circuits with capping2015
Microstructure device including a metallization structure with self-aligned air 2014
Microstructure device including a metallization structure with self-aligned air 2014
Contact elements of a semiconductor device formed by electroless plating and exc2013
Contact elements of semiconductor devices formed on the basis of a partially app2013
Contact elements of semiconductor devices formed on the basis of a partially app2013
Automatic deposition profile targeting2012
Metal cap layer of increased electrode potential for copper-based metal regions 2012
Metal cap layer of increased electrode potential for copper-based metal regions 2012