Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuits and methods for fabricating integrated circuits with capping layers between metal contacts and interconnects

Integrated circuits and methods for fabricating integrated circuits with capping layers between metal contacts and interconnects

US Patent 8932911 · Granted Jan 13, 2015

Estimated economic value: $1,493,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Agricultural harvesting vehicle2025
Systems and methods for delivering pressurized fluid to a target site alone or i2025
Portable power tool2025
Distortion determination apparatus and method of determining a distortion2025
Phase angle correction value calculation apparatus and method of calculating a p2025
System for characterizing a transistor circuit2025
Optical range calculation apparatus and method of range calculation2025
Motorcycle with handlebar protector2024
Optical range calculation apparatus and method of extending a measurable range2024
Motorcycle with a multifunctional device2024
Indirect time of flight range calculation apparatus and method of calculating a 2024
Drill for chiselling rock2023