Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7745327 | Method of forming a copper-based metallization layer including a conductive cap layer by an advanced integration regime | Axel Preusse, Robert Seidel, Berit Freudenberg | 2010-06-29 |
| 7071096 | Method of forming a conductive barrier layer within critical openings by a final deposition step after a re-sputter deposition | Volker Kahlert | 2006-07-04 |
| 6984294 | Method of forming a conductive barrier layer having improved coverage within critical openings | Volker Kahlert | 2006-01-10 |
| 6841468 | Method of forming a conductive barrier layer having improve adhesion and resistivity characteristics | Volker Kahlert | 2005-01-11 |