Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7745327 | Method of forming a copper-based metallization layer including a conductive cap layer by an advanced integration regime | Axel Preusse, Michael Friedemann, Robert Seidel | 2010-06-29 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7745327 | Method of forming a copper-based metallization layer including a conductive cap layer by an advanced integration regime | Axel Preusse, Michael Friedemann, Robert Seidel | 2010-06-29 |