Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7375031 | Technique for forming interconnect structures with reduced electro and stress migration and/or resistivity | Axel Preusse, Wolfgang Buchholtz, Petra Hetzer, Elvira Buchholtz | 2008-05-20 |