Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7656037 | Integrated circuit with improved component interconnections | Martina Hommel, Markus Schwerd, Martin Seck | 2010-02-02 |
| 6057229 | Method for metallizing submicron contact holes in semiconductor bodies | Konrad Hieber, Helmuth Treichel | 2000-05-02 |
| 5478780 | Method and apparatus for producing conductive layers or structures for VLSI circuits | Helmuth Treichel, Konrad Hieber, Peter Kuecher | 1995-12-26 |