Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5478780 | Method and apparatus for producing conductive layers or structures for VLSI circuits | Heinrich Koerner, Helmuth Treichel, Konrad Hieber | 1995-12-26 |
| 5396184 | Method for the in situ identification of the sheet resistivity or, respectively, of process parameters of thin, electrically conductive layers manufactured under the influence of a plasma | E-Wolfgang Frank, Johann Helneder | 1995-03-07 |
| 4924295 | Integrated semi-conductor circuit comprising at least two metallization levels composed of aluminum or aluminum compounds and a method for the manufacture of same | — | 1990-05-08 |
| 4910580 | Method for manufacturing a low-impedance, planar metallization composed of aluminum or of an aluminum alloy | Guenther Roeska | 1990-03-20 |