Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10761046 | Electrochemical sensors and packaging and related methods | Joseph R. Stetter, Vinay Patel, William Escobar | 2020-09-01 |
| 8686558 | Thermally and electrically enhanced ball grid array package | Sam Ziqun Zhao, Reza-ur Rahman Khan, Edward Law | 2014-04-01 |
| 8039949 | Ball grid array package having one or more stiffeners | Sam Ziqun Zhao, Rezaur Rahman Khan, Edward Law | 2011-10-18 |
| 7629681 | Ball grid array package with patterned stiffener surface and method of assembling the same | Sam Ziqun Zhao, Reza-ur Rahman Khan, Edward Law | 2009-12-08 |
| 6882042 | Thermally and electrically enhanced ball grid array packaging | Sam Ziqun Zhao, Reaz-ur Rahman Khan, Edward Law | 2005-04-19 |
| 5438224 | Integrated circuit package having a face-to-face IC chip arrangement | Bruce J. Freyman, Frank J. Juskey, John R. Thome | 1995-08-01 |
| 5288769 | Thermally conducting adhesive containing aluminum nitride | Robert W. Pennisi, James Lynn Davis | 1994-02-22 |
| 5136365 | Anisotropic conductive adhesive and encapsulant material | Robert W. Pennisi, Glenn F. Urbish | 1992-08-04 |
| 5132778 | Transfer molding compound | Frank J. Juskey, Robert W. Pennisi | 1992-07-21 |
| 5128746 | Adhesive and encapsulant material with fluxing properties | Robert W. Pennisi | 1992-07-07 |
| 5019673 | Flip-chip package for integrated circuits | Frank J. Juskey, Barry M. Miles | 1991-05-28 |