Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5198264 | Method for adhering polyimide to a substrate | Jill L. Flaugher, Barry M. Miles | 1993-03-30 |
| 5091218 | Method for producing a metallized pattern on a substrate | Dale W. Dorinski | 1992-02-25 |
| 5055816 | Method for fabricating an electronic device | Robert E. Stengel | 1991-10-08 |
| 5024372 | Method of making high density solder bumps and a substrate socket for high density solder bumps | Jill L. Flaugher, Anthony B. Suppelsa, William B. Mullen, III | 1991-06-18 |
| 4948941 | Method of laser drilling a substrate | Thomas N. Johnson | 1990-08-14 |
| 4827326 | Integrated circuit having polyimide/metal passivation layer and method of manufacture using metal lift-off | Kevin D. Moore, John D. Shurboff | 1989-05-02 |