Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8274162 | Apparatus and method for reduced delamination of an integrated circuit module | Antonio Espinoza, Waldemar J. Holgado | 2012-09-25 |
| 8030770 | Substrateless package | Frank J. Juskey | 2011-10-04 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8274162 | Apparatus and method for reduced delamination of an integrated circuit module | Antonio Espinoza, Waldemar J. Holgado | 2012-09-25 |
| 8030770 | Substrateless package | Frank J. Juskey | 2011-10-04 |