Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5463190 | Electrically conductive adhesive | Robert T. Carson, Arnold W. Hogrefe | 1995-10-31 |
| 5444303 | Wire bond pad arrangement having improved pad density | Jonathon G. Greenwood, Douglas W. Hendricks | 1995-08-22 |
| 5438216 | Light erasable multichip module | Anthony B. Suppelsa, Dale W. Dorinski | 1995-08-01 |
| 5438224 | Integrated circuit package having a face-to-face IC chip arrangement | Marc Papageorge, Bruce J. Freyman, John R. Thome | 1995-08-01 |
| 5371404 | Thermally conductive integrated circuit package with radio frequency shielding | Anthony B. Suppelsa | 1994-12-06 |
| 5336931 | Anchoring method for flow formed integrated circuit covers | Douglas W. Hendricks | 1994-08-09 |
| 5323947 | Method and apparatus for use in forming pre-positioned solder bumps on a pad arrangement | Kenneth M. Wasko, Douglas W. Hendricks | 1994-06-28 |
| 5313365 | Encapsulated electronic package | Robert W. Pennisi, Glenn E. Gold, Glenn F. Urbish | 1994-05-17 |
| 5296046 | Subliming solder flux composition | Douglas W. Hendricks | 1994-03-22 |
| 5296738 | Moisture relief for chip carrier | Bruce J. Freyman, Barry M. Miles | 1994-03-22 |
| 5264061 | Method of forming a three-dimensional printed circuit assembly | Anthony B. Suppelsa, Dale W. Dorinski | 1993-11-23 |
| 5232758 | Non-hardening solvent removable hydrophobic conformal coatings | Anthony B. Suppelsa, Kenneth M. Wasko | 1993-08-03 |
| 5218759 | Method of making a transfer molded semiconductor device | Lonnie L. Bernardoni, Bruce J. Freyman, Anthony B. Suppelsa | 1993-06-15 |
| 5220489 | Multicomponent integrated circuit package | Joaquin Barreto, Juan Alfonso | 1993-06-15 |
| 5177669 | Molded ring integrated circuit package | Anthony B. Suppelsa, Linda K. Berrian | 1993-01-05 |
| 5166772 | Transfer molded semiconductor device package with integral shield | Keith D. Soldner, Bruce J. Freyman, Barry M. Miles | 1992-11-24 |
| 5153385 | Transfer molded semiconductor package with improved adhesion | Lonnie L. Bernardoni, Thomas J. Swirbel, Barry M. Miles | 1992-10-06 |
| 5132778 | Transfer molding compound | Robert W. Pennisi, Marc Papageorge | 1992-07-21 |
| 5077633 | Grounding an ultra high density pad array chip carrier | Bruce J. Freyman, Barry M. Miles | 1991-12-31 |
| 5075820 | Circuit components having different characteristics with constant size | Anthony J. Suppelsa, Anthony B. Suppelsa | 1991-12-24 |
| 5065122 | Transmission line using fluroplastic as a dielectric | Anthony B. Suppelsa, Jill L. Flaugher | 1991-11-12 |
| 5019673 | Flip-chip package for integrated circuits | Barry M. Miles, Marc Papageorge | 1991-05-28 |
| 4940181 | Pad grid array for receiving a solder bumped chip carrier | Barry M. Miles, Anthony B. Suppelsa | 1990-07-10 |