Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7102214 | Pre-molded leadframe | Jeffrey Alan Miks | 2006-09-05 |
| 7049682 | Multi-chip semiconductor package with integral shield and antenna | Douglas J. Mathews, Robert J. Hill, Michael P. Gaynor, John Armando Miranda, Christopher M. Scanlan | 2006-05-23 |
| 6798047 | Pre-molded leadframe | Jeffrey Alan Miks | 2004-09-28 |
| 6686649 | Multi-chip semiconductor package with integral shield and antenna | Douglas J. Mathews, Robert J. Hill, Michael P. Gaynor, John Armando Miranda, Christopher M. Scanlan | 2004-02-03 |
| 6534338 | Method for molding semiconductor package having a ceramic substrate | Frank J. Juskey, Anthony James LoBianco | 2003-03-18 |
| 6417576 | Method and apparatus for attaching multiple metal components to integrated circuit modules | Ron Ellenberger, Frank J. Juskey | 2002-07-09 |
| 4564563 | Solderable conductor | F. Wayne Martin, Samson Shahbazi | 1986-01-14 |
| 4535012 | Fast curing solderable conductor | F. Wayne Martin, Samson Shahbazi | 1985-08-13 |
| 4481261 | Blister-resistant dielectric | Gary W. Johnson, David G. Hilson | 1984-11-06 |
| 4350618 | Thick film conductors for use in microelectronic packaging | David G. Hilson, Gary W. Johnson | 1982-09-21 |