Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10607960 | Substrate structure with selective surface finishes for flip chip assembly | Thomas Scott Morris | 2020-03-31 |
| 10283480 | Substrate structure with selective surface finishes for flip chip assembly | Thomas Scott Morris | 2019-05-07 |
| 9935066 | Semiconductor package having a substrate structure with selective surface finishes | Thomas Scott Morris | 2018-04-03 |
| 9646857 | Low pressure encapsulant for size-reduced semiconductor package | Howard Terry Glascock, Frank J. Juskey, Thomas Scott Morris, Charles E. Carpenter | 2017-05-09 |
| 9269887 | Ultrathin flip-chip packaging techniques and configurations | Frank J. Juskey, Thomas Scott Morris, Howard Terry Glascock, Jose F. Ordonez | 2016-02-23 |
| 9169536 | Process for providing noble metal-containing mixtures for recovering noble metals | Klaus Zimmermann, Oswald Kinz, Matthias Grehl | 2015-10-27 |
| 8680683 | Wafer level package with embedded passive components and method of manufacturing | Frank J. Juskey | 2014-03-25 |