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Curable silicone compositions |
Liya JIA, Yuanzhi YUE |
2022-12-06 |
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Microphone system with a stop member |
Lee James Jacobson, Sushil Bharatan, Thomas Chen |
2016-05-10 |
| 9258634 |
Microphone system with offset apertures |
Thomas M. Goida |
2016-02-09 |
| 9142470 |
Packages and methods for packaging |
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2015-09-22 |
| 9002040 |
Packages and methods for packaging MEMS microphone devices |
— |
2015-04-07 |
| 8853839 |
Air-release features in cavity packages |
Jia Gao, Shafi Saiyed, Siu Lung Ng, Xiaojie Xue |
2014-10-07 |
| 8779535 |
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Thomas M. Goida |
2014-07-15 |
| 8723308 |
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2014-05-13 |
| 8577063 |
Packages and methods for packaging MEMS microphone devices |
— |
2013-11-05 |
| 8447057 |
Packages and methods for packaging MEMS microphone devices |
Thomas M. Goida, Woodrow Beckford |
2013-05-21 |
| 7224070 |
Plurality of semiconductor die in an assembly |
— |
2007-05-29 |
| 7145253 |
Encapsulated sensor device |
Tae-Soo Kim, Young Hyo Eun, Jong-Wook Park, David DoSung Chun, Hee Yeoul Yoo |
2006-12-05 |
| 7078264 |
Stacked semiconductor die |
— |
2006-07-18 |
| 6909167 |
Coupling spaced bond pads to a contact |
— |
2005-06-21 |
| 6807218 |
Laser module and optical subassembly |
Jonathon G. Greenwood, Robert Francis Darveaux |
2004-10-19 |
| 6759307 |
Method to prevent die attach adhesive contamination in stacked chips |
— |
2004-07-06 |
| 6620648 |
Multi-chip module with extension |
— |
2003-09-16 |
| 6580160 |
Coupling spaced bond pads to a contact |
— |
2003-06-17 |
| 6453547 |
Coupling spaced bond pads to a contact |
— |
2002-09-24 |
| 6274930 |
Multi-chip module with stacked dice |
Venkateshwaran Vaiyapuri |
2001-08-14 |
| 6207467 |
Multi-chip module with stacked dice |
Venkateshwaran Vaiyapuri |
2001-03-27 |
