Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490510 | Cavity package with composite substrate | Dipak Sengupta | 2019-11-26 |
| 10287161 | Stress isolation features for stacked dies | Michael J. Zylinski, Thomas M. Goida, Kathleen O'Donnell | 2019-05-14 |
| 9728510 | Cavity package with composite substrate | Dipak Sengupta | 2017-08-08 |
| 9698127 | Integrated device die and package with stress reduction features | Thomas M. Goida | 2017-07-04 |
| 9343367 | Integrated device die and package with stress reduction features | Thomas M. Goida | 2016-05-17 |
| 9278851 | Vertical mount package and wafer level packaging therefor | — | 2016-03-08 |
| 9209121 | Double-sided package | Thomas M. Goida | 2015-12-08 |
| 8853839 | Air-release features in cavity packages | Jia Gao, Jicheng Yang, Shafi Saiyed, Siu Lung Ng | 2014-10-07 |
| 8836132 | Vertical mount package and wafer level packaging therefor | — | 2014-09-16 |
| 8692366 | Apparatus and method for microelectromechanical systems device packaging | Carl Raleigh | 2014-04-08 |
| 8624380 | Vertical mount package for MEMS sensors | Carl Raleigh, Thomas M. Goida | 2014-01-07 |
| 8174111 | Vertical mount package for MEMS sensors | Carl Raleigh, Thomas M. Goida | 2012-05-08 |