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Youn-Jae Kook, Yeonsung Kim |
2020-03-17 |
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Xiaojie Xue |
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Kieran P. Harney, Brian Moss, Alain Valentin Guery |
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Integrated device packages having a MEMS die sealed in a cavity by a processor die and method of manufacturing the same |
Shafi Saiyed |
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Xiaojie Xue |
2017-08-08 |
| 9716193 |
Integrated optical sensor module |
— |
2017-07-25 |
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Microphone module with sound pipe |
Kieran P. Harney, Brian Moss, Alain Valentin Guery |
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Jicheng Yang, Asif Chowdhury, Manolo Mena, Jia Gao, Richard J. Sullivan +2 more |
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Microphone module with sound pipe |
Kieran P. Harney, Brian Moss, Alain Valentin Guery |
2014-07-01 |
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Jicheng Yang, Asif Chowdhury, Manolo Mena, Jia Gao, Rick Sullivan +2 more |
2014-05-13 |
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Computed tomography detector module |
Alain Valentin Guery, Camille Huin |
2013-10-08 |
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Shrenik Deliwala |
2013-09-17 |
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Thomas M. Goida |
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Cover cap for semiconductor wafer devices |
Maurice S. Karpman |
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