Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10681821 | Methods and devices for improved space utilization in wafer based modules | — | 2020-06-09 |
| 10453787 | Method and apparatus for forming multi-layered vias in sequentially fabricated circuits | Nicole Mueller, Gary B. Tepolt, Russell Berman | 2019-10-22 |
| 10418249 | Method and apparatus for using universal cavity wafer in wafer level packaging | Michael Rickley, Andrew J. Mueller, Nicole Mueller, Jeffrey C. Thompson, Charles Baab | 2019-09-17 |
| 10315914 | Reconstructed wafer based devices with embedded environmental sensors and process for making same | — | 2019-06-11 |
| 10265516 | Closely spaced array of penetrating electrodes | Andrew Meuller | 2019-04-23 |
| 9941223 | Devices and methods for detecting counterfeit semiconductor devices | — | 2018-04-10 |
| 9847230 | Method and apparatus for using universal cavity wafer in wafer level packaging | Michael Rickley, Andrew J. Mueller, Nicole Mueller, Jeffrey C. Thompson, Charles Baab | 2017-12-19 |
| 9735128 | Method for incorporating stress sensitive chip scale components into reconstructed wafer based modules | — | 2017-08-15 |
| 9293440 | Method for interconnecting die and substrate in an electronic package | Michael Holm, Matt Shea | 2016-03-22 |
| 9257355 | Method for embedding a chipset having an intermediary interposer in high density electronic modules | Brian R. Smith | 2016-02-09 |
| 8785249 | Three dimensional microelectronic components and fabrication methods for same | — | 2014-07-22 |
| 7608534 | Interconnection of through-wafer vias using bridge structures | Changhan Hobie Yun, Javier Villarreal | 2009-10-27 |
| 7416984 | Method of producing a MEMS device | John R. Martin, Manolo Mena, Elmer S. Lacsamana | 2008-08-26 |
| 7338705 | Static dissipation treatments for optical package windows | John R. Martin, Lawrence E. Felton | 2008-03-04 |
| 7166911 | Packaged microchip with premolded-type package | Nicole Hablutzel, Peter Farrell, Michael Judy, Lawrence E. Felton, Lewis Long | 2007-01-23 |
| 7033672 | Static dissipation treatments for optical package windows | John R. Martin, Lawrence E. Felton | 2006-04-25 |
| 6964882 | Fabricating complex micro-electromechanical systems using a flip bonding technique | Chang-Han Yun, Lawrence E. Felton, John A. Yasaitis, Michael Judy, Colin Gormley | 2005-11-15 |
| 6946742 | Packaged microchip with isolator having selected modulus of elasticity | — | 2005-09-20 |
| 6933163 | Fabricating integrated micro-electromechanical systems using an intermediate electrode layer | Chang-Han Yun, Lawrence E. Felton, John A. Yasaitis, Michael Judy, Colin Gormley | 2005-08-23 |
| 6893976 | Shadow mask and method of producing the same | Swaminathan Rajaraman | 2005-05-17 |
| 6828674 | Hermetically sealed microstructure package | — | 2004-12-07 |
| 6713829 | Single unit position sensor | — | 2004-03-30 |
| 6686993 | Probe card for testing optical micro electromechanical system devices at wafer level | Nicholas Pizzi, Jr. | 2004-02-03 |
| 6555904 | Electrically shielded glass lid for a packaged device | — | 2003-04-29 |
| 6534340 | Cover cap for semiconductor wafer devices | Dipak Sengupta | 2003-03-18 |