Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8343369 | Method of producing a MEMS device | Manolo Mena, Elmer S. Lacsamana, William A. Webster | 2013-01-01 |
| 7795723 | Capped sensor | Kevin Chau, John A. Geen, Michael Judy, John R. Martin | 2010-09-14 |
| 7521363 | MEMS device with non-standard profile | John R. Martin | 2009-04-21 |
| 7357017 | Wafer level capped sensor | Kieran P. Harney, Carl M. Roberts, Jr. | 2008-04-15 |
| 7338705 | Static dissipation treatments for optical package windows | John R. Martin, Maurice S. Karpman | 2008-03-04 |
| 7275424 | Wafer level capped sensor | Kieran P. Harncy, Carl M. Roberts, Jr. | 2007-10-02 |
| 7166911 | Packaged microchip with premolded-type package | Maurice S. Karpman, Nicole Hablutzel, Peter Farrell, Michael Judy, Lewis Long | 2007-01-23 |
| 7040922 | Multi-surface mounting member and electronic device | Kieran P. Harney, Lewis Long | 2006-05-09 |
| 7033672 | Static dissipation treatments for optical package windows | John R. Martin, Maurice S. Karpman | 2006-04-25 |
| 6964882 | Fabricating complex micro-electromechanical systems using a flip bonding technique | Chang-Han Yun, Maurice S. Karpman, John A. Yasaitis, Michael Judy, Colin Gormley | 2005-11-15 |
| 6940636 | Optical switching apparatus and method of assembling same | — | 2005-09-06 |
| 6936918 | MEMS device with conductive path through substrate | Kieran P. Harney, Thomas Kieran Nunan, Susan A. Alie, Bruce Wachtmann | 2005-08-30 |
| 6933163 | Fabricating integrated micro-electromechanical systems using an intermediate electrode layer | Chang-Han Yun, Maurice S. Karpman, John A. Yasaitis, Michael Judy, Colin Gormley | 2005-08-23 |
| 6931170 | Fiber-attached optical devices with in-plane micromachined mirrors | Chang-Han Yun, Shanti Bhattacharya, Yakov Reznichenko, John R. Martin, Jeffrey Ralph Swift +2 more | 2005-08-16 |
| 6893574 | MEMS capping method and apparatus | Peter Farrell, Jing Luo, David J. Collins, John R. Martin, William A. Webster | 2005-05-17 |
| 6759273 | Method and device for protecting micro electromechanical systems structures during dicing of a wafer | Jing Luo | 2004-07-06 |
| 6352935 | Method of forming a cover cap for semiconductor wafer devices | David J. Collins, Craig Core, Jing Luo | 2002-03-05 |