Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7563632 | Methods for packaging and sealing an integrated circuit die | John R. Martin | 2009-07-21 |
| 7508064 | Package for sealing an integrated circuit die | John R. Martin | 2009-03-24 |
| 7357017 | Wafer level capped sensor | Lawrence E. Felton, Kieran P. Harney | 2008-04-15 |
| 7275424 | Wafer level capped sensor | Lawrence E. Felton, Kieran P. Harncy | 2007-10-02 |
| 6911727 | Package for sealing an integrated circuit die | John R. Martin | 2005-06-28 |
| 6621158 | Package for sealing an integrated circuit die | John R. Martin | 2003-09-16 |
| 6323550 | Package for sealing an integrated circuit die | John R. Martin | 2001-11-27 |
| 5362681 | Method for separating circuit dies from a wafer | Lewis H. Long, Paul A. Ruggerio | 1994-11-08 |
| 5026667 | Producing integrated circuit chips with reduced stress effects | — | 1991-06-25 |
| 4866505 | Aluminum-backed wafer and chip | John R. Saxelby, Jr., Roger M. Moseson | 1989-09-12 |