Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8344487 | Stress mitigation in packaged microchips | Xin Zhang, Michael Judy, Kevin Chau, Nelson Kuan, Timothy Spooner +1 more | 2013-01-01 |
| 7166911 | Packaged microchip with premolded-type package | Maurice S. Karpman, Nicole Hablutzel, Michael Judy, Lawrence E. Felton, Lewis Long | 2007-01-23 |
| 6893574 | MEMS capping method and apparatus | Lawrence E. Felton, Jing Luo, David J. Collins, John R. Martin, William A. Webster | 2005-05-17 |
| 5736607 | Hermetically sealed dies and die attach materials | John R. Martin | 1998-04-07 |