Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453787 | Method and apparatus for forming multi-layered vias in sequentially fabricated circuits | Maurice S. Karpman, Nicole Mueller, Russell Berman | 2019-10-22 |
| 9693469 | Electronic module subassemblies | John Merullo, Jeffrey C. Thompson, Berj Nercessian | 2017-06-27 |
| 9425069 | Electronic modules | Livia M. Racz, Jeffrey C. Thompson, Thomas A. Langdo, Andrew J. Mueller | 2016-08-23 |
| 8535984 | Electronic modules and methods for forming the same | Livia M. Racz, Jeffrey C. Thompson, Thomas A. Langdo, Andrew J. Mueller | 2013-09-17 |
| 8273603 | Interposers, electronic modules, and methods for forming the same | Livia M. Racz, Jeffrey C. Thompson, Thomas A. Langdo, Andrew J. Mueller | 2012-09-25 |
| 8017451 | Electronic modules and methods for forming the same | Livia M. Racz, Jeffrey C. Thompson, Thomas A. Langdo, Andrew J. Mueller | 2011-09-13 |
| 7981698 | Removal of integrated circuits from packages | Dariusz R. Pryputniewicz, Thomas F. Marinis | 2011-07-19 |
| 7960247 | Die thinning processes and structures | Jeffrey C. Thompson, Livia M. Racz | 2011-06-14 |
| 5746565 | Robotic wafer handler | — | 1998-05-05 |
| 5611886 | Process chamber for semiconductor substrates | Stephen A. Bachman | 1997-03-18 |
| 4850299 | Semiconductor wafer coating apparatus with angular oscillation means | John Merullo | 1989-07-25 |