| 11702335 |
Low stress integrated device package |
Yeonsung Kim, Shafi Saiyed |
2023-07-18 |
$223,630,000 |
| 10800651 |
Low stress integrated device packages |
— |
2020-10-13 |
$80,537,000 |
| 10287161 |
Stress isolation features for stacked dies |
Xiaojie Xue, Michael J. Zylinski, Kathleen O'Donnell |
2019-05-14 |
$18,504,000 |
| 9698127 |
Integrated device die and package with stress reduction features |
Xiaojie Xue |
2017-07-04 |
|
| 9573800 |
Pre-molded MEMS device package having conductive column coupled to leadframe and cover |
— |
2017-02-21 |
$14,288,000 |
| 9533878 |
Low stress compact device packages |
Kathleen O'Donnell, Michael D. Delaus |
2017-01-03 |
$16,460,000 |
| 9475694 |
Two-axis vertical mount package assembly |
Arturo Martizon, Jr. |
2016-10-25 |
$9,242,000 |
| 9407997 |
Microphone package with embedded ASIC |
Michael D. Delaus, Kathy O'Donnell |
2016-08-02 |
$3,303,000 |
| 9343367 |
Integrated device die and package with stress reduction features |
Xiaojie Xue |
2016-05-17 |
$34,057,000 |
| 9260293 |
Pre-molded MEMS device package with conductive shell |
— |
2016-02-16 |
$6,248,000 |
| 9258634 |
Microphone system with offset apertures |
Jicheng Yang |
2016-02-09 |
$6,348,000 |
| 9215519 |
Reduced footprint microphone system with spacer member having through-hole |
— |
2015-12-15 |
$4,515,000 |
| 9209121 |
Double-sided package |
Xiaojie Xue |
2015-12-08 |
$21,589,000 |
| 9162872 |
Pre-molded MEMS device package having conductive column coupled to leadframe and cover |
— |
2015-10-20 |
$10,799,000 |
| 9142470 |
Packages and methods for packaging |
Jicheng Yang, Asif Chowdhury, Manolo Mena, Jia Gao, Richard J. Sullivan +2 more |
2015-09-22 |
$30,222,000 |
| 9079760 |
Integrated microphone package |
Jason P. Fiorillo |
2015-07-14 |
$6,827,000 |
| 8946879 |
Packages and methods for 3D integration including two stacked dies with a portion of one die extending into a hole of the other die |
— |
2015-02-03 |
$14,181,000 |
| 8941223 |
MEMS device package with conductive shell |
— |
2015-01-27 |
$17,953,000 |
| 8779535 |
Packaged integrated device die between an external and internal housing |
Jicheng Yang |
2014-07-15 |
$26,690,000 |
| 8723308 |
Packages and methods for packaging using a lid having multiple conductive layers |
Jicheng Yang, Asif Chowdhury, Manolo Mena, Jia Gao, Rick Sullivan +2 more |
2014-05-13 |
$5,985,000 |
| 8624380 |
Vertical mount package for MEMS sensors |
Xiaojie Xue, Carl Raleigh |
2014-01-07 |
$9,395,000 |
| 8447057 |
Packages and methods for packaging MEMS microphone devices |
Jicheng Yang, Woodrow Beckford |
2013-05-21 |
$13,884,000 |
| 8174111 |
Vertical mount package for MEMS sensors |
Xiaojie Xue, Carl Raleigh |
2012-05-08 |
$24,367,000 |
| 7939916 |
Wafer level CSP packaging concept |
Alan J. O'Donnell, Oliver Kierse |
2011-05-10 |
$14,216,000 |
| 7871865 |
Stress free package and laminate-based isolator package |
Dipak Sengupta |
2011-01-18 |
$28,903,000 |