| 12027472 |
Integrated circuit packages to minimize stress on a semiconductor die |
Ramji Sitaraman Lakshmanan, Bernard Patrick Stenson, Padraig L. Fitzgerald, Michael James Twohig, Michael John Flynn +1 more |
2024-07-02 |
| 11616027 |
Integrated circuit packages to minimize stress on a semiconductor die |
Ramji Sitaraman Lakshmanan, Bernard Patrick Stenson, Padraig L. Fitzgerald, Michael James Twohig, Michael John Flynn +1 more |
2023-03-28 |
| 10730743 |
Gas sensor packages |
Rigan McGeehan, Alfonso Berduque, Donal McAuliffe, Raymond J. Speer, Brendan Cawley +2 more |
2020-08-04 |
| 10461151 |
Localized strain relief for an integrated circuit |
Patrick F. M. Poucher, Padraig L. Fitzgerald, John Jude O'Donnell, Denis M. O'Connor |
2019-10-29 |
| 9786609 |
Stress shield for integrated circuit package |
Frank Poucher, Michael J. Cusack, Padraig L. Fitzgerald, Patrick Elebert |
2017-10-10 |
| 9661408 |
Packages and methods for packaging |
Christian Lillelund |
2017-05-23 |
| 9466666 |
Localized strain relief for an integrated circuit |
Patrick F. M. Poucher, Padraig L. Fitzgerald, John Jude O'Donnell, Denis M. O'Connor |
2016-10-11 |
| 9156680 |
Packages and methods for packaging |
Christian Lillelund |
2015-10-13 |
| 8890301 |
Packaging and methods for packaging |
— |
2014-11-18 |
| 8766186 |
Control aperture for an IR sensor |
Eamon Hynes |
2014-07-01 |
| 8476591 |
Radiation sensor device and method |
Eamon Hynes |
2013-07-02 |
| 8193620 |
Integrated circuit package with enlarged die paddle |
John Alberghini |
2012-06-05 |
| 7938014 |
Sealed capacitive sensor |
Peter Meehan, William Hunt, Eamon Hynes, John O'Dowd |
2011-05-10 |
| 7939916 |
Wafer level CSP packaging concept |
Alan J. O'Donnell, Thomas M. Goida |
2011-05-10 |
| 7897920 |
Radiation sensor device and method |
Eamon Hynes |
2011-03-01 |
| 7880244 |
Wafer level CSP sensor |
— |
2011-02-01 |
| 7667323 |
Spaced, bumped component structure |
John O'Dowd, John Wynne, William Hunt, Eamon Hynes, Peter Meehan |
2010-02-23 |
| 7401523 |
Capacitive sensor and method of fabricating |
Peter Meehan |
2008-07-22 |
| 6225683 |
Die size-increasing integrated circuit leads and thermally enhanced leadframe |
Prasad Yalamanchili |
2001-05-01 |
| 5796159 |
Thermally efficient integrated circuit package |
— |
1998-08-18 |
| 5541446 |
Integrated circuit package with improved heat dissipation |
— |
1996-07-30 |
| 5486720 |
EMF shielding of an integrated circuit package |
— |
1996-01-23 |