Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11467357 | Emitter module | Cailin WEI, Jihua Du | 2022-10-11 |
| 10962726 | Structure for fiber attachment with adhesive material | Frank Wu, Raman Srinivasan, Huijie Xu | 2021-03-30 |
| 10763639 | Emitter-on-sub-mount device | Kong Weng Lee, Vincent V. Wong, Jay A. Skidmore, Gity Samadi, Raman Srinivasan +2 more | 2020-09-01 |
| 9036678 | Light emitting semiconductor device | Reddy Raju, Richard L. Duesterberg, Jay A. Skidmore, Xiangdong Qiu | 2015-05-19 |
| 9008139 | Structure and method for edge-emitting diode package having deflectors and diffusers | Pezhman Monadgemi, Vincent V. Wong, Reddy Raju, Erik Paul Zucker, Jay A. Skidmore | 2015-04-14 |
| 8475056 | Semiconductor device assembly | Xiangdong Qiu, Reddy Raju, Jay A. Skidmore, Michael Au, Laura Zavala +1 more | 2013-07-02 |
| 8215850 | Optical module with fiber feedthrough | Xiangdong Qiu, Reddy Raju, Jihua Du | 2012-07-10 |
| 6969205 | Optical fiber pigtail assembly | Richard L. Duesterberg, Edmund L. Wolak, Marc K. Von Gunten, Nina Morozova, Donald Hargreaves +7 more | 2005-11-29 |
| 6225683 | Die size-increasing integrated circuit leads and thermally enhanced leadframe | Oliver Kierse | 2001-05-01 |
| 5929514 | Thermally enhanced lead-under-paddle I.C. leadframe | — | 1999-07-27 |