Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9249010 | Electrical shielding in a MEMS leadframe package | Brian William Cousins | 2016-02-02 |
| 8692366 | Apparatus and method for microelectromechanical systems device packaging | Xiaojie Xue | 2014-04-08 |
| 8624380 | Vertical mount package for MEMS sensors | Xiaojie Xue, Thomas M. Goida | 2014-01-07 |
| 8174111 | Vertical mount package for MEMS sensors | Xiaojie Xue, Thomas M. Goida | 2012-05-08 |
| 6300167 | Semiconductor device with flame sprayed heat spreading layer and method | William C. Roman | 2001-10-09 |
| 5751552 | Semiconductor device balancing thermal expansion coefficient mismatch | Christopher M. Scanlan | 1998-05-12 |
| 5269453 | Low temperature method for forming solder bump interconnections to a plated circuit trace | Cynthia M. Melton, Kenneth Cholewczynski, Kevin D. Moore | 1993-12-14 |
| 5233504 | Noncollapsing multisolder interconnection | Cynthia M. Melton, Steven Scheifers | 1993-08-03 |
| 5186383 | Method for forming solder bump interconnections to a solder-plated circuit trace | Cynthia M. Melton, Kenneth Cholewczynski, Kevin D. Moore | 1993-02-16 |
| 5154341 | Noncollapsing multisolder interconnection | Cynthia M. Melton, Steven Scheifers | 1992-10-13 |
| 5086966 | Palladium-coated solder ball | Cynthia M. Melton, Steven Scheifers, William M. Beckenbaugh | 1992-02-11 |