Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7829379 | Wafer level stacked die packaging | — | 2010-11-09 |
| 5084753 | Packaging for multiple chips on a single leadframe | Carl M. Goida, Jr. | 1992-01-28 |
| D316955 | Padlock | Domenic Martignetti, L. James Newman, III | 1991-05-21 |
| 4700935 | Fixture for wave soldering packaged integrated circuits | Russell T. Winslow | 1987-10-20 |