Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Low stress compact device packages

Low stress compact device packages

US Patent 9533878 · Granted Jan 3, 2017

Estimated economic value: $16,460,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Varying waveforms across frames in frequency-modulated continuous-wave (FMCW) li2024
Resolving return signals among pixels in frequency-modulated continuous-wave (FM2023
Low stress integrated device package2023
Low stress integrated device packages2020
Stress isolation features for stacked dies2019
Stress isolation features for stacked dies2019
Integrated device die and package with stress reduction features2017
Pre-molded MEMS device package having conductive column coupled to leadframe and2017
Two-axis vertical mount package assembly2016
Microphone package with embedded ASIC2016
Microphone package with embedded ASIC2016
Integrated device die and package with stress reduction features2016