Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837331 | Semiconductor device having overlapped via apertures | Jin Seong Kim, Dong Joo Park, Kwang Ho Kim, Jeong Wung Jeong | 2017-12-05 |
| 9177932 | Semiconductor device having overlapped via apertures | Jin Seong Kim, Dong Joo Park, Kwang Ho Kim, Jeong Wung Jeong | 2015-11-03 |
| 8557629 | Semiconductor device having overlapped via apertures | Jin Seong Kim, Dong Joo Park, Kwang Ho Kim, Jeong Wung Jeong | 2013-10-15 |
| 7145253 | Encapsulated sensor device | Tae-Soo Kim, Young Hyo Eun, Jicheng Yang, Jong-Wook Park, David DoSung Chun | 2006-12-05 |
| 6087715 | Semiconductor device, and manufacturing method of the same | Kanako Sawada, Atsushi Kurosu, Kenji Takahashi | 2000-07-11 |
| 5937279 | Semiconductor device, and manufacturing method of the same | Kanako Sawada, Atsushi Kurosu, Kenji Takahashi | 1999-08-10 |
| 5661338 | Chip mounting plate construction of lead frame for semiconductor package | Youn Cheol Yoo, Jeong S. Lee, Doo Hyun Park, In Gyu Han | 1997-08-26 |