Timothy L. Jackson — 25 Patents at Micron

Timothy L. Jackson has been granted 25 US patents while listed as an inventor at Micron. The first was granted in 1991 and the most recent in May 2012. Timothy L. Jackson ranks #158,593 of 4,157,543 US inventors in our database (top 3.8%). Patent records list Timothy L. Jackson in Boise, ID, US.

Patents per Year

Issued Patents All Time

Showing 1–25 of 25 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
8184748	Narrow band receiver	Peter Massam, Philip Alan Bowden, Timothy David Howe	2012-05-22
7811903	Thin flip-chip method	Ford B. Grigg	2010-10-12	$3,573,000
7755204	Stacked die module including multiple adhesives that cure at different temperatures	Chad A. Cobbley	2010-07-13	$3,221,000
7355273	Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods	Tim Murphy	2008-04-08	$2,204,000
7291543	Thin flip-chip method	Ford B. Grigg	2007-11-06	$2,950,000
7217596	Stacked die module and techniques for forming a stacked die module	Chad A. Cobbley	2007-05-15	$2,539,000
7186576	Stacked die module and techniques for forming a stacked die module	Chad A. Cobbley	2007-03-06	$2,227,000
7029931	Stacked die module and techniques for forming a stacked die module	Chad A. Cobbley	2006-04-18	$2,761,000
6988225	Verifying a fault detection result based on a process control state	Matthew A. Purdy, Richard J. Markle	2006-01-17	$20,825,000
6985825	Method and apparatus for adaptive sampling based on process covariance	Richard P. Good, Brian K. Cusson	2006-01-10	$17,911,000
6962867	Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof	Tim Murphy	2005-11-08	$2,956,000
6925347	Process control based on an estimated process result	Michael L. Miller, Thomas J. Sonderman, Alexander J. Pasadyn, Richard J. Markle, Brian K. Cusson +2 more	2005-08-02	$7,108,000
6905946	Thin flip-chip method	Ford B. Grigg	2005-06-14	$1,402,000
6800930	Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies	Tim Murphy	2004-10-05	$2,061,000
6682955	Stacked die module and techniques for forming a stacked die module	Chad A. Cobbley	2004-01-27	$3,111,000
6664131	Method of making ball grid array package with deflectable interconnect	—	2003-12-16	$2,294,000
6630738	Deflectable interconnect	—	2003-10-07	$3,475,000
6563300	Method and apparatus for fault detection using multiple tool error signals	Richard J. Markle, Edward C. Stewart	2003-05-13	$1,759,000
6506681	Thin flip—chip method	Ford B. Grigg	2003-01-14	$3,226,000
6503777	Deflectable interconnect	—	2003-01-07	$2,731,000
6501176	Deflectable interconnect	—	2002-12-31	$3,585,000
6285081	Deflectable interconnect	—	2001-09-04	$11,707,000
6244064	Combination toolbox-cooler device	Arthur G. Powell, Melvin T. Willis, Sr., Maurice L. Monroe, Benjamin Scandrett	2001-06-12
5410124	Tracking sensor fixture and method for tracking reference locations on a moving semiconductor leadframe strip	—	1995-04-25	$12,906,000
5048664	Reciprocating staging fixture	Ronald M. Gines	1991-09-17	$1,413,000

Timothy L. Jackson — 25 Patents

Patents per Year

Issued Patents All Time

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